Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Patent
1998-07-20
2000-09-19
Chaudhari, Chandra
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Thinning of semiconductor substrate
438409, H01L 2130
Patent
active
061211176
ABSTRACT:
A process for producing a semiconductor substrate comprises heat-treating a substrate having a monocrystal thereon in a reducing atmosphere.
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Sakaguchi Kiyofumi
Sato Nobuhiko
Yonehara Takao
Canon Kabushiki Kaisha
Chaudhari Chandra
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