Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1998-11-24
2000-09-19
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438106, 438107, H01L 2144, H01L 2148, H01L 2150
Patent
active
061210706
ABSTRACT:
A flip-chip semiconductor device comprises a carrier substrate having a conductor pattern on at least one side and at least one semiconductor die with an active surface and an opposed ground surface. A conductive backing plate is conductively bonded to the ground surface. The active surface faces and is electrically connected to the conductor pattern of the carrier substrate. A conductive down-bond connection is provided between the backing plate and a ground connection or reference potential connection. The backing plate is preferably rigid and can be manipulated for indirect alignment of the die or dice carried thereon relative to the substrate.
REFERENCES:
patent: 5120678 (1992-06-01), Moore et al.
patent: 5311059 (1994-05-01), Banerji et al.
patent: 5677575 (1997-10-01), Maeta et al.
patent: 5786230 (1998-07-01), Anderson et al.
patent: 5915170 (1999-06-01), Raab et al.
Collins D. Mark
Micro)n Technology, Inc.
Picardat Kevin M.
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