Long wavelength light emitting vertical cavity surface emitting

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

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438 41, 438 29, 372 96, H01L 2100

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active

061210684

ABSTRACT:
A longwavelength vertical cavity surface emitting laser (VCSEL) for use in optical telecommunications and method of fabrication that includes the fabrication of an active VCSEL structure on a supporting substrate and the fabrication of a highly reflective DBR mirror structure on a silicon substrate. The DBR mirror structure includes alternating layers of a silicon oxide material and a silicon material fabricated utilizing epitaxially growth techniques and/or wafer bonding using SOI wafer fusion technology. During fabrication of the final VCSEL device, the Si/SiO.sub.2 DBR mirror structure is wafer bonded to the active VCSEL structure. The active VCSEL structure supporting substrate is selectively removed, to enable positioning of a second DBR mirror stack. The final VCSEL device characterized by emitting infra-red light.

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"Long Wavelength VCSELs using AIAs/GaAs Mirrors and Strain-Compensated Quantum Wells", Proceedings IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits, Ithaca, NY, pp. 361-363.

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