High-density electronic modules--process and product

Details High-density electronic modules--process and product High-density electronic modules--process and product

1986-04-25

1987-11-10

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Miscellaneous

357 75, 250578, H05K 710, H05K 712

Patent

active

047061669

ABSTRACT:
A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all the leads of the stack are exposed on an access plane. Bonding bumps are formed at appropriate points on the access plane. A supporting substrate, formed of a light transparent material, such as silicon, is provided with suitable circuitry and bonding bumps on its face. A layer of insulation is applied to either the access plane or the substrate face, preferably the latter. The bonding bumps on the insulation-carrying surface are formed after the insulation has been applied. The substrated face is placed on the access plane of the stack, their bonding bumps are microscopically aligned, and then bonded together under heat and/or pressure. A layer of thermally conductive (but electrically non-conductive) adhesive material is inserted between the substrate and stack. The substrate and stack combination is then placed and wire bonded in a protective container having leads extending therethrough for external connection.

REFERENCES:
patent: 4447857 (1984-05-01), Marks et al.
patent: 4525921 (1985-07-01), Carson et al.
patent: 4551629 (1985-11-01), Carson et al.
patent: 4617160 (1986-10-01), Belanger et al.

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