Semiconductor device and method of producing the same

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Details

357 70, 357 68, H01L 2302, H01L 2304, H01L 2310, H01L 2348

Patent

active

047061057

ABSTRACT:
A semiconductor device comprising a square package body, a plurality of leads which jut out from each of four sides of the package body, a beveled portion which is formed in at least one corner of the package body, and leads which jut out from the beveled portion.

REFERENCES:
patent: 4289922 (1981-09-01), Devlin
patent: 4301464 (1981-11-01), Otsuki et al.

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