Patent
1986-06-13
1987-11-10
James, Andrew J.
357 70, 357 68, H01L 2302, H01L 2304, H01L 2310, H01L 2348
Patent
active
047061057
ABSTRACT:
A semiconductor device comprising a square package body, a plurality of leads which jut out from each of four sides of the package body, a beveled portion which is formed in at least one corner of the package body, and leads which jut out from the beveled portion.
REFERENCES:
patent: 4289922 (1981-09-01), Devlin
patent: 4301464 (1981-11-01), Otsuki et al.
Masuda Masachika
Murakami Gen
Clark S. V.
Hitachi , Ltd.
James Andrew J.
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