Method of manufacturing I/O terminals on I/O pads

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29833, 174266, 2281791, H01K 330

Patent

active

054541590

ABSTRACT:
To manufacture I/O terminals on I/O pads of an electronic component, the electronic component, together with a transparent alignment component which has a reference feature, is placed in a fixture such that the I/O pads are seen through the alignment component and a first one of the two components has a fixed position in the fixture. Thereafter, a second one of the two components is moved in the fixture until a particular position is reached where the I/O pads are aligned with the reference feature; and at that particular position the second one of the two components is confined. Subsequently, the alignment component is replaced at its particular position in the fixture, as attained by the above steps, with an opaque template which has a hole pattern that matches and aligns with the I/O pads. Then, the template hole pattern as positioned by the replacing step, is used to fabricate the I/O terminals on the I/O pads.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5359768 (1994-11-01), Haley
IBM Tech. Discl Bull vol. 15 No. 6 Nov. 1972 pp. 1999-2000 by O. R. Abalafia et al.
IBM Tech. Discl Bull vol. 37 No. 02B, Feb. 1994, p. 337.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing I/O terminals on I/O pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing I/O terminals on I/O pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing I/O terminals on I/O pads will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1070961

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.