Noncontact dynamic tester for integrated circuits

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324 73R, G01R 3102, G01R 1900

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active

047060182

ABSTRACT:
Testing of integrated circuit process intermediates, such as wafers, dise or chips in various stages of production (test chips) is facilitated by a nonintrusive, noncontact dynamic testing technique, using a pulsed laser, with laser light modification to increase photon energy through conversion to shorter wavelength. The high energy laser light excites electron emissions to pass to the detection system as a composite function of applied light energy and of dynamic operation of the circuit; detecting those emissions by an adjacent detector requires no ohmic contacts or special circuitry on the integrated circuit chip or wafer. Photoelectron energy emitted from a test pad on the test chip is detected as a composite function of the instantaneous input voltage as processed on the test chip, in dynamic operation including improper operation due to fault. The pulse from the laser, as modified through light modification, the parameters of detection of bias voltages, and the distances involved in chip-grid-detector juxtaposition, provides emissions for detection of circuit voltages occurring on the test chip under dynamic conditions simulating actual or stressed operation, with high time resolution of the voltages and their changes on the circuit.

REFERENCES:
patent: 3129353 (1964-04-01), Nemes
patent: 3370168 (1968-02-01), Komoda
patent: 4266138 (1981-05-01), Nelson, Jr. et al.
patent: 4332833 (1982-06-01), Aspnes et al.
patent: 4380864 (1983-04-01), Das
patent: 4408883 (1983-10-01), Iwamoto et al.
patent: 4417948 (1983-11-01), Mayne-Banton et al.
patent: 4581578 (1986-04-01), Honma et al.
"Microwave Trapped Plasma Devices Observed on a 356 Hz Sampling Oscilloscope", Carroll et al., S0361-0043, pp. 545,547, 9/20/79, 324-158D.
"Scanning Electron Beam Probes VLSI Chips", Fazekas et al., S1777-0028, Electronics, 7/14/81, vol. 54, #14, pp. 105-112, 324-158R.
Rubloff, "Contactless Measurement of Voltage Levels Using Photoemission," IBM Technical Disclosure Bulletin, vol. 25, No. 3A, Aug. 1982, pp. 1171-1172.
Henley, "Logic Failure Analysis of CMOS Using a Laser Probe," Spectrum Sciences, 3050 Oakmead Village Drive, Santa Clara, Calif., 95051.
Rev. Scientific Instruments, vol. 49, No. 6, Jun. 1978, pp. 756-759, American Institute of Physics, New York, M. Kudo et al., "Computer Controlled ESCA for Nondestructive Surface Characterization Utilizing a TV-Type Position Sensitive Detector.
Fujitsu-Scientific & Technical Journal, vol. 19, No. 4, 1983, pp. 431-441, Kawasaki, Japan, A. Ito et al., "Hemispherical Retarding Type Energy Analyzer for LSI Testing by an Electron Beam".
Microelectronics Journal, vol. 11, No. 2, Mar./Apr. 1980, pp. 35-40, Mackintosh Publications Ltd., Luton, GB; C. E. Jowett, "Surface Analytical Techniques Applied to Electronic Components".
"Data Probe Model 2010 IC Logic Laser Analyzer," Mitsui & Co., 1984.
Menzel and Kubalek, "Secondary Electron Detection Systems for Quantitative Voltage Measurements," Scanning, Vol. 5, 151-171 (1983).

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