Semiconductor device, method of manufacturing the semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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257673, 257735, 257690, H01L 2348, H01L 2946

Patent

active

060607688

ABSTRACT:
A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection ports are formed in the leads with a second pitch. The sealing plastic seals the lines connecting the electrode pads and the leads, but the projections are exposed from the sealing plastic.

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