Process for producing a resin bonded magnet structure

Details Process for producing a resin bonded magnet structure Process for producing a resin bonded magnet structure

1992-02-21

1992-09-22

Theisen, Mary Lynn

Plastic and nonmetallic article shaping or treating: processes

Forming articles by uniting randomly associated particles

Stratified or layered articles

148101, 148105, 252 6254, 264122, 264DIG58, B29C 4318

Patent

active

051494779

ABSTRACT:
A process for producing resin bonded magnet structures is disclosed which includes the steps of: (a) adding a solid epoxy resin of at least one epoxy oligomer and a microcapsule which contains at least one liquid epoxy resin to a melt spun powder of a rare earth element-iron alloy to form a granulated intermediate material, wherein the epoxy oligomer has alcoholic hydroxyl groups in the molecular chain thereof and the solid epoxy resin has a softening temperature (Durran's melting point) of 65.degree. C. to 85.degree. C.; (b) mixing the granulated intermediate material with a powdered curing agent and a lubricant to form a compound; (c) forming a green body of a resin bonded magnet by compressing the compound, and then integrating the green body directly with a supporting member; and (d) curing the solid and liquid epoxy resins in the green body by application of heat to form a rigid structure of the resin bonded magnet integrated with the supporting member.

REFERENCES:
patent: 4684406 (1987-08-01), Matsuura et al.
patent: 4832891 (1989-05-01), Kass
patent: 4981635 (1991-01-01), Yamashita et al.

Affiliated with

Also associated with

Rating

Process for producing a resin bonded magnet structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing a resin bonded magnet structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing a resin bonded magnet structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1066609