Method for fabricating long array orifice plates

Details Method for fabricating long array orifice plates Method for fabricating long array orifice plates

1991-07-18

1992-09-22

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Perforated or foraminous article

205 67, 205 96, C25D 108

Patent

active

051494191

ABSTRACT:
A method for electroforming linear orifice plates includes the steps of: placing electrically conductive robber panels adjacent edges of an electrically conductive plating substrate bearing a linear insulative peg pattern; coupling the plating surface of the plating substrate to the adjacent robber panels with a thin strip of electrically conductive material; and electroplating to form an orifice plate with precisely uniform diameter orifices.

REFERENCES:
patent: 2675348 (1954-04-01), Greenspan
patent: 4067782 (1978-01-01), Bailey et al.
patent: 4184925 (1980-01-01), Kenworthy
patent: 4246076 (1981-01-01), Gardner
patent: 4374707 (1983-02-01), Pollack
patent: 4855020 (1989-08-01), Sirbolo
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, p. 147.

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