Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1997-06-18
2000-05-09
Wilson, Donald R.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523445, 523457, 523428, C08G 5940, C08G 5920, C08K 322, C08K 328
Patent
active
060605391
ABSTRACT:
A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-.degree. F. (0.7 W/m-K).
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Morrison & Boyd, "Organic Chemistry", Allyn and Bacon, Inc., Boston, p. 31, (1979).
Hermansen Ralph D.
Lau Steven E.
Alkov Leonard A.
Lenzen, Jr. Glenn H.
Raufer Colin M.
Raytheon Company
Wilson Donald R.
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