Packing method of semiconductor device

Details Packing method of semiconductor device Packing method of semiconductor device

1998-07-16

2000-05-09

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438106, 438107, 438111, H01L 2144, H01L 2148, H01L 2150

Patent

active

060603402

ABSTRACT:
Disclosed is a packaging method of semiconductor device comprising the following step, preparing a PCB or BGA substrate with array-typed dam formed thereupon; placing a plurality of semiconductor devices into the array-typed dam, and attaching each semiconductor devices onto the dam grid; wire-bonding the semiconductor devices; performing lid-covering or resin-sealing process. The present invention forms the dam structure necessary for the package by an off-line process, and then attaches the dam structure on the substrate. Therefore, the problems of damage of PCB or substrate and short circuit due to the high-temperature and high-pressure pressing process can be prevented, moreover, the yield and the reliability can be enhanced.

REFERENCES:
patent: 5639695 (1997-06-01), Jones et al.
patent: 5744084 (1998-04-01), Chia et al.
patent: 5895222 (1999-04-01), Moden et al.

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