Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent
1999-12-09
2000-09-19
Ryan, Patrick
Metal fusion bonding
Process
Repairing, restoring, or renewing product for reuse
228 51, 228 19, 219229, 219231, B23K 302, B23K 303, B23K 100, H05B 100, H05B 342
Patent
active
061199192
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a method for repairing defective soldered joints and an apparatus for repairing defective soldered joints with a soldering material handling device and a soldering material isolating device.
BACKGROUND OF THE INVENTION
In the industrial manufacture of components in microelectronics, such as for example wafers, multichip modules and also so-called, chip-size packages", these components are provided with soldering material deposits in preparation for a subsequent contacting with further components or mounting boards on a connection area distribution provided at their surface. In order to produce the soldering material deposits, apparatuses are used which apply isolated soldering material units to soldering material carriers formed by the individual connection areas of the connection area distribution and produce a connection of the soldering material units with the respective connection area.
Such an apparatus is known for example from DE 195 41 996, which shows a soldering material isolating device for producing isolated soldering material units with a soldering material application device for the application and connection of soldering material units with the connection areas.
Due to statistical irregularities in the process parameters and minute geometrical differences in the coordination between the soldering material application device and the soldering material carrier, or else because of the surface geometry of the soldering material carrier, there occur during the execution of such methods for producing soldering material deposits increasing numbers of defectively formed soldering material deposits. The range of the possible defects extends here from the complete absence of a soldering material deposit on a connection area to the formation of short-circuit between adjacent soldering material deposits. To date the occurrence of such defects in the production of soldering material deposits has been as a rule synonymous with the elimination of the corresponding components as rejects.
There is known from WO-A-97/12714 a method and an apparatus which can be used for repairing defective soldered joints, and in which, in addition to a handling device for the application of a component to a substrate, which is used simultaneously for the melting of a soldered joint, the use of further separate devices is recommended, in order to apply soldering material to the substrate for the contacting of the component or to remove it.
SUMMARY AND OBJECTS OF THE INVENTION
The present invention is therefore based on the object of proposing a method, or an apparatus suitable for the carrying out of such a method, which simplifies the repair of defective soldering material deposits.
In order to achieve this object, the method according to the invention comprises the features of claim 1.
With the method according to the invention for repairing defective soldered joints a soldering material handling device is in a first method step placed at a soldering material defect point together with a soldering material removing device and a defective soldering material deposit is loosened from the connection with a soldering material carrier and removed. In a second method step a soldering material unit is applied to the soldering material carrier with a soldering material application device of the soldering material handling device, said soldering material application device being placed at the soldering material defect point, and connected to the soldering material carrier.
According to the invention, in order to form the soldering material removal device and in order to form the soldering material application device, one and the same soldering material handling device is operated in two different types of function. The necessity, in order to carry out the method according to the invention, to provide the soldering material removal device and the soldering material application device as separate devices is thereby dispensed with. Both functions can instead be carried out b
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Cooke Colleen
Pac Tech - Packaging Technologies GmbH
Ryan Patrick
LandOfFree
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