Wire bonding apparatus and bonding load correction method for th

Details Wire bonding apparatus and bonding load correction method for th Wire bonding apparatus and bonding load correction method for th

Filed on

1998-04-02

Date issued

2000-09-19

Examiner

Mills, Gregory

Patent Class

Metal fusion bonding

SubClass

Process

SubSubClass

With condition responsive, program, or timing control

Other Related Categories

228 45, 228 9, 2281805, B23K 3102, B23Q 1522, B23Q 1600

Type

Patent

Status

active

Patent number

061199176

Description

ABSTRACT:
A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.

REFERENCES:
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4597519 (1986-07-01), Kurtz et al.
patent: 5011061 (1991-04-01), Funatsu
patent: 5060841 (1991-10-01), Oshima et al.
patent: 5207370 (1993-05-01), Mochida et al.
patent: 5316201 (1994-05-01), Sugiura
patent: 5443200 (1995-08-01), Arikado
patent: 5586713 (1996-12-01), Arita et al.
patent: 5645210 (1997-07-01), Toner et al.
patent: 5816477 (1998-10-01), Shimizu

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