Method for processing a substrate using a system having a roller

Details Method for processing a substrate using a system having a roller Method for processing a substrate using a system having a roller

1999-01-07

2000-05-09

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

134 9, 134 32, 134 33, 134902, 15 77, 15 881, 15 882, 15 883, B08B 302, B08B 104, B08B 1100

Patent

active

060598891

ABSTRACT:
A method for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.

REFERENCES:
patent: 2335594 (1943-11-01), Kerr
patent: 2646612 (1953-07-01), Shearer
patent: 2857605 (1958-10-01), Weishaar
patent: 3327721 (1967-06-01), Carlson
patent: 3599306 (1971-08-01), Brafford
patent: 3937919 (1976-02-01), Clerx et al.
patent: 4202071 (1980-05-01), Scharpf
patent: 4483434 (1984-11-01), Miwa et al.
patent: 4705711 (1987-11-01), Perna
patent: 4826071 (1989-05-01), Becker
patent: 5028200 (1991-07-01), Shimane
patent: 5129876 (1992-07-01), Brabant et al.
patent: 5183378 (1993-02-01), Asano et al.
patent: 5188273 (1993-02-01), Schmoock
patent: 5391135 (1995-02-01), Kuroki et al.
patent: 5475889 (1995-12-01), Thrasher et al.
patent: 5533243 (1996-07-01), Asano
patent: 5566466 (1996-10-01), Hearne
patent: 5840129 (1998-11-01), Saenz et al.
patent: 5861066 (1999-01-01), Moinpour et al.

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