Using cone shaped search models to locate ball bonds on wire bon

Details Using cone shaped search models to locate ball bonds on wire bon Using cone shaped search models to locate ball bonds on wire bon

1994-05-02

1996-08-27

Voeltz, Emanuel T.

Boots, shoes, and leggings

364491, 382145, 382169, 382199, 348 87, G01B 1124, G01N 2186

Patent

active

055507638

ABSTRACT:
Method and apparatus for automatically locating the center of a ball bond of a wire to a lead frame and semiconductor chip or similar device; analyzing the optically sensed images; a bonding mechanism; and a host controller connected to the bonding mechanism, the movable platform. The present invention constructs a synthetic flattened cone model using a center radius, and monotonically increasing slope values to generate a model having a variation in grey levels, and inner and outer radii that will encompass expected size variations in a ball bond; sets a threshold for acceptable normalized correlation search results; acquires a digitized image of the bond, including a nominal location for the bond; conducts a normalized correlation search of the digitized image at the bond location, using the flattened synthetic cone model; and indicates the presence and location of the expected circular object as the location having the largest coefficient which exceeds a threshold.

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