Process for thermal cracking of 1,2-dichloroethane to form vinyl

Organic compounds -- part of the class 532-570 series – Organic compounds – Halogen containing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C07C 1724, C07C 1734

Patent

active

047467592

ABSTRACT:
An improved process for the preparation of vinyl chloride from 1,2-dichloroethane (EDC) wherein 0.10 to 0.15 % by weight of carbon tetrachloride based on EDC, is used as a cracking promoter and the CHCl.sub.3 content is limited to less than 200 ppm. Before being fed to the cracking zone, the EDC is brought almost to the boiling point at 15 to 31 bar and then expanded to 10 to 16 bar with flashing EDC vapors and the fraction which has remained liquid is vaporized externally, and the combined EDC gas streams are heated, after being fed into the cracking furnaces, so that the energy required for cracking is already supplied in the first 75 to 85% of the reaction zone, whereby a conversion of 60 to 70% is obtained at residence time from 10 to 25 seconds and the exit temperature from the reaction zone is 485.degree. to 510.degree. C.

REFERENCES:
patent: 2724006 (1955-11-01), Krekeler
patent: 3476955 (1969-11-01), Krekeler et al.
patent: 3903182 (1975-09-01), Rechmeier et al.
patent: 3998706 (1976-12-01), Fruhwirt et al.
patent: 4590318 (1986-05-01), Longhini
patent: 4665243 (1987-05-01), Burts, Jr.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for thermal cracking of 1,2-dichloroethane to form vinyl does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for thermal cracking of 1,2-dichloroethane to form vinyl, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for thermal cracking of 1,2-dichloroethane to form vinyl will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1059512

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.