Semiconductor assembly including mounting plate with recessed pe

Details Semiconductor assembly including mounting plate with recessed pe Semiconductor assembly including mounting plate with recessed pe

1974-12-23

1976-11-30

James, Andrew J.

357 65, 357 70, 357 75, 357 79, 357 81, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

039953106

ABSTRACT:
Disclosed is an assembly with a semiconductor pellet mounting plate that defines two substantially parallel major surfaces, at least one surface having a central planar region surrounded by a smaller peripheral transition region such that the periphery of the major surface is recessed and out of the plane of the central planar region. A semiconductor pellet is mounted on the central planar region and the metallic contacts on the pellet are substantially coextensive with the central planar region. The peripheral transition region can take any of several disclosed forms.

REFERENCES:
patent: 3200310 (1965-08-01), Carman
patent: 3292056 (1966-12-01), Emeis et al.
patent: 3303432 (1967-02-01), Garfinkel
patent: 3447118 (1969-05-01), Ferree
patent: 3551758 (1970-12-01), Ferree
patent: 3562592 (1971-02-01), Cooke et al.
patent: 3670404 (1972-06-01), Kamoshida
patent: 3708720 (1973-01-01), Whitney
patent: 3831067 (1974-08-01), Wislocky et al.
patent: 3869787 (1975-03-01), Umbaugh

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