Magnetron sputtering cathode for vacuum coating apparatus

Details Magnetron sputtering cathode for vacuum coating apparatus Magnetron sputtering cathode for vacuum coating apparatus

1986-08-15

1988-05-24

Niebling, John F.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1434

Patent

active

047464178

ABSTRACT:
A magnetron sputtering cathode for vacuum coating apparatus has a circular target plate and at least one magnet system disposed in back of it which forms at least one endless tunnel of magnetic lines of force over the target plate. In the marginal area of the target plate there is disposed a first magnet system for the production of a first magnetic tunnel substantially concentric with the axis of rotation, and between the axis of rotation and the first magnet system there is an off-center second magnet system which produces a second magnetic tunnel extending over only a sector of the target plate. When the two magnet systems are rotated together the elements of the surface of the target plate are exposed to the product of the time of stay times the intensity such that the target plate is ablated more uniformly in the middle area and more strongly at the margin, so that a substrate field placed opposite the target plate is uniformly coated.

REFERENCES:
patent: 4444643 (1984-04-01), Garrett
patent: 4498969 (1985-02-01), Ramachandran
patent: 4631106 (1986-12-01), Nakazato et al.

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