Method for producing an identification card with an integrated c

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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29827, 29841, 156293, 156295, 26427217, B32B 3100

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active

047463929

ABSTRACT:
A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

REFERENCES:
patent: 3206647 (1965-09-01), Kahn
patent: 3622419 (1971-11-01), London
patent: 3702464 (1972-11-01), Castrucci
patent: 3778685 (1973-12-01), Kennedy
patent: 4079511 (1978-03-01), Grabbe
patent: 4216577 (1980-08-01), Badet
patent: 4417413 (1983-11-01), Hoppe et al.
patent: 4460825 (1984-07-01), Tehrani et al.
patent: 4474292 (1984-10-01), Haghiri-Tehrani et al.
"A Plastic Computer For Your Wallet", USA Today, Dec. 5, 1983, pp. 1-2 (357/72).
Handbook of Material Trade Names, Suppl. IV to 1953 ed., Dover, Industrial Research Service, 1965, pp. 320-321.

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