Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-08-04
1988-05-24
Dawson, Robert A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156245, 156344, 264139, 264344, B32B 3118
Patent
active
047463899
ABSTRACT:
A method is disclosed for providing a clean, highly conductive mating surface in a composite panel which includes an embedded aluminum wire mesh to achieve lightning and electromagnetic interference shielding. The method includes the steps of laying a nonporous tape in a mold corresponding with the area requiring a highly conductive mating surface, laying one or more plies of aluminum mesh thereover to provide a conductive path, and then laying a nonporous barrier tape ply above the mating surface, sandwiching the metal mesh therebetween, with structural plies laid thereover. During curing, the tapes prevent direct resin inclusion into the metal mesh. After curing, the nonporous tape is removed to expose the clean, highly conductive mating surface. Utilizing the above-described method substantially increases the ability to provide a clean conductive mating surface without utilizing extensive equipment or processing steps, providing enhanced EMI shielding in composite structures.
REFERENCES:
patent: 4661186 (1987-04-01), DeBernardi
patent: 4685987 (1987-08-01), Fick
patent: 4707207 (1987-11-01), Baus
Dawson Robert A.
United Technologies Corporation
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