Thermal expansion compensated metal lead frame for integrated ci

Details Thermal expansion compensated metal lead frame for integrated ci Thermal expansion compensated metal lead frame for integrated ci

1985-02-01

1990-04-17

Wojciechowicz, Edward J.

357 81, H01L 2348

Patent

active

049185110

ABSTRACT:
A metal lead frame for an integrated circuit package is disclosed having stress relieving means formed therein to inhibit breakage of a thermally mismatched silicon die subsequently attached thereto and then heated during normal operation of the device. The stress relieving means may comprise parallel grooves formed in one or both surfaces of the central portion of the lead frame where a silicon integrated circuit die will subsequently be bonded to the lead frame. Preferably, the grooves are formed in both axes comprising the plane of the lead frame and may be formed on both surfaces of the lead frame. The stress relieving means may also comprise a series of openings cut through the central portion of the lead frame.

REFERENCES:
patent: 4410905 (1983-10-01), Grabbe
patent: 4417266 (1983-11-01), Grabbe
patent: 4482915 (1984-11-01), Nishikawa et al.
patent: 4523218 (1985-06-01), Kato

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