1988-10-31
1990-04-17
Edlow, Martin H.
357 59, 357 236, 357 2311, 357 41, H01L 2702
Patent
active
049185101
ABSTRACT:
A compact CMOS structure and method for fabricating the structure are disclosed. In one embodiment of the invention the structure includes a P-type surface region in a silicon substrate surrounded by a field oxide which extends, at least in part, above the surface of the substrate. A polycrystalline silicon sidewall frame is formed at the sidewall of the field oxide and a gate insulator is formed over both the polycrystalline silicon frame and the silicon surface region. A common gate electrode is formed which traverses the frame and the surface region. P-type source and drain regions are formed in the polycrystalline silicon frame on opposite sides of the gate electrode and N-type source and drain regions are formed in the surface region on opposite sides of the gate electrode.
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patent: 4404579 (1983-09-01), Leuschner
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patent: 4710897 (1987-12-01), Masuoka
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Edlow Martin H.
Fisher John A.
Monin D.
Motorola Inc.
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