Serial fan cooling subsystem for computer systems

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361689, 361695, 415 66, H05K 500

Patent

active

055462723

ABSTRACT:
A cooling subsystem and method for a chassis of a computer system. The cooling subsystem comprises: (1) first and second cooling fans having first and second motors associated therewith for driving the first and second cooling fans, respectively and (2) a common plenum substantially shrouding and providing a pathway for air communication between the first and second cooling fans, the first and second fans cooperating to provide an optimum rate of air flow from without the chassis to within the chassis to provide air exchange within the chassis, the air flow within the chassis being in a predetermined direction to provide directed cooling of a specified device within the chassis, the common plenum allowing the first and second fans to continue to cooperate to provide a minimum air flow to provide a minimum air exchange within the chassis, the air flow remaining in the predetermined direction to continue the directed cooling of the specified device when a selected one of the first and second motors fails.

REFERENCES:
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patent: 3903404 (1975-09-01), Beall et al.
patent: 4386651 (1983-06-01), Reinhard
patent: 4756473 (1988-07-01), Takemae et al.
patent: 4774631 (1988-09-01), Okuyama et al.
patent: 5136465 (1992-08-01), Benck et al.
patent: 5438226 (1995-08-01), Kuchta
"Staggered Logic/Memory Board Configuration for Improved Card Cooling" IBM Technical Disclosure Bulletin; vol. 20, No. 7; Dec. 1977.

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