Method and apparatus for dissipating heat from a transducer elem

Details Method and apparatus for dissipating heat from a transducer elem Method and apparatus for dissipating heat from a transducer elem

1994-11-21

1996-08-13

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310334, 310340, 310346, 174 163, H01L 4108

Patent

active

055459420

ABSTRACT:
A device for improving heat dissipation inside an ultrasound probe and reducing heat build-up near the transducer face. Heat conductors are placed around the periphery of the transducer package, but within the probe housing, so that heat can be drawn away from the transducer face and toward the rear/interior of the probe. The heat conductors act as conduits for draining away heat which builds up in the thermal potting material during pulsation of the piezoelectric transducer elements. The heat conductors are formed from metal foil having a heat conductivity greater than the heat conductivity of the thermal potting material which fills the spaces inside the probe housing and surrounds the transducer package. The preferred metal foil is aluminum.

REFERENCES:
patent: 3071736 (1963-01-01), Vonbun et al.
patent: 4553059 (1985-11-01), Abe et al.
patent: 5272599 (1993-12-01), Koenen
patent: 5309321 (1994-05-01), Olla et al.
patent: 5420751 (1995-05-01), Burns
patent: 5446620 (1995-08-01), Burns

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