Method for embodying an electric circuit on an active element of

Details Method for embodying an electric circuit on an active element of Method for embodying an electric circuit on an active element of

1991-06-27

1993-09-21

Quach, T. N.

Fishing, trapping, and vermin destroying

437 56, 437228, 437978, 156653, H01L 21283, H01L 21336

Patent

active

052468828

ABSTRACT:
A method of making an electric contact of an MIS integrated circuit includes the following stages: depositing a thick film made of one first electric nonconductor on the integrated circuit provided with this element; depositing on the first nonconductor film a crash or barrier film made of a highly resistive material or a nonconductor able to be etched selectively with respect to the first nonconductor and a second electric nonconductor; forming opposite the active element a first opening in the barrier film and fixing the dimensions at the level of the active element of the electric contact to be embodied; depositing on the resulting structure obtained at least one second nonconducting film forming a second opening in the second nonconducting film, the second opening having a width larger than that the first opening; etching of the first nonconductor exposed during the previous step by using the etched barrier film as a mask, thus forming an electric contact hole of the active element, and metallizing of this contact hole.

REFERENCES:
patent: 4299862 (1981-11-01), Donley
patent: 4485553 (1984-12-01), Christian et al.
patent: 4789648 (1988-12-01), Chow et al.
patent: 5010039 (1991-04-01), Ku et al.
patent: 5022958 (1991-06-01), Favreau et al.
patent: 5032530 (1991-07-01), Lowrey et al.
Grewal, V., et al., "Contact hole and via . . .", 1987 Proceedings V-MIC Conf., Jun. 15-16, pp. 298-305.
Kaanta, C., et al., "Submicron Wiring . . .", 1988 Proceedings V-MIC Conf., Jun. 13-14, pp. 21-28.

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