Conductive rie-resistant collars for studs beneath rie-defined w

Fishing – trapping – and vermin destroying

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437194, 437198, 437195, H01L 2144

Patent

active

055455905

ABSTRACT:
An improved method of forming interlayer interconnections employs the same material (or materials that are etched similarly) for both the stud and the upper interconnect in which the stud is surrounded by a collar of conductive material that is also resistant to the etching process used to define the upper wire interconnect.

REFERENCES:
patent: 4589196 (1986-05-01), Anderson
patent: 4666737 (1987-05-01), Gimpelson et al.
patent: 5270254 (1993-12-01), Chen et al.
patent: 5356833 (1994-11-01), Maniar et al.

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