Method of forming a bump having a rugged side, a semiconductor d

Details Method of forming a bump having a rugged side, a semiconductor d Method of forming a bump having a rugged side, a semiconductor d

1994-01-27

1996-08-13

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437189, 437192, 437193, H01L 2144

Patent

active

055455891

ABSTRACT:
According to the present invention, a method for forming bumps for electrically connecting electrode pads of a semiconductor device to terminal electrodes formed on a surface of a circuit board respectively, the semiconductor device being mounted facedown on the surface of the circuit board, includes: step a of forming the bumps on the electrode pad of the semiconductor device: step b of placing facedown the semiconductor device on a flat foundation so that the bumps contact with a grind sheet which is fixed to the flat foundation and which has abrasive grind; and step c of conducting ultrasonic vibration on the flat foundation while pressing the semiconductor device against the flat foundation, thereby forming a rugged side in a front end portion of each of the bumps.

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IBM Technical Disclosure Bulletin, "High Strength Thermocompression Bonds," vol. 30, No. 7 (Dec. 1987), pp. 208-209.
"Semiconductor Chip Technique", IC Mounting Technique, Jan. 15, 1980 (partial English translation provided). Apr. 29, 1994.
European Search Report (corresponding to EP 94101266).

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