Printed circuit boards and cards having buried thin film capacit

Details Printed circuit boards and cards having buried thin film capacit Printed circuit boards and cards having buried thin film capacit

1990-04-09

1991-06-25

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29 2542, 357 51, 361386, H05K 720, H01L 2702, H01G 700, H01G 410

Patent

active

050272535

ABSTRACT:
Disclosed is a multilayer circuit package having a buried thin film capacitor. The circuit package includes at least a power core, a ground core, a first signal core, a second signal core, and the integral, buried, thin film capacitor. The integral, buried, thin film capacitor serves to capacitively couple the first and second signal cores. Structurally, the first signal core includes at least one first wire that terminates in at least one first electrode, while the second signal core includes at least one second wire that terminates in at least one second electrode. At least a portion of the first electrode overlays at least a portion of the first electrode overlays at least a portion of the second electrode and is separated therefrom by a thin film of a dielectric material. The first electrode, the second electrode, and the thin film of dielectric material define the integral buried capacitor. The thin film capacitor is prepared by thin film methodology, with epitaxial deposition of the dielectric.

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