Interconnection lead having individual spiral lead design

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Details

357 68, 357 69, H01L 2348

Patent

active

050722816

ABSTRACT:
An interconnection lead is provided for electrically and physically connecting a plurality of bonding sites on an integrated circuit to a plurality of external electrical connections. The interconnection lead contains a plurality of individual electrical leads which have been formed so as to have an arcuate shape at the region where each individual lead is bonded to the integrated circuit. In addition, the arcuate shapes are all of similar length and all rotate in the same direction around the integrated circuit. This design provides enhanced strain relief during use, since the arcuate shapes permit rotation of the integrated circuit during mounting or excessive lead stress.

REFERENCES:
patent: 3803458 (1974-04-01), Morena, Jr.
patent: 3902148 (1975-08-01), Drees et al.
patent: 3947867 (1976-03-01), Duffek et al.
patent: 4529999 (1985-07-01), Bender et al.

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