Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-02-28
1993-09-21
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174260, 22818022, 361777, 437183, H05K 334, H05K 100
Patent
active
052457508
ABSTRACT:
An integrated circuit chip (26, 34) is connected to a circuit trace by providing a raised feature on a circuit trace (17, 28) which is coated with a material capable of forming an electrical connection (23, 32), as well as an attachment when the pad (25, 33) of an integrated circuit chip (26, 34) is brought into engagement with it. This material may be solder (23) or it may be a Z-axis adhesive (32) which becomes conductive at areas where it is compressed. The raised feature or bump (18, 31) on the circuit trace (17, 28) may be produced by providing a mandrel (10) having a recess (12) complementary to the raised feature (18, 31) to be provided, and suitably plating the circuit trace (17, 28) on the mandrel (10) including the recessed area (12). Upon subsequent lamination of a dielectric layer (19, 30) and removal from the mandrel (10), there is produced a circuit trace (17, 28) on a dielectric with a raised feature (18, 31) which can be used to attach to an integrated circuit chip (26, 34).
REFERENCES:
patent: 4403272 (1983-09-01), Larson et al.
patent: 4835859 (1989-06-01), Beckett
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5027995 (1991-07-01), Karl et al.
patent: 5121299 (1992-06-01), Frankeny et al.
Crumly William R.
Feigenbaum Haim
Arbes Carl J.
Denson-Low Wanda K.
Gudmestad Terje
Hughes Aircraft Company
Leitereg Elizabeth E.
LandOfFree
Method of connecting a spaced IC chip to a conductor and the art does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of connecting a spaced IC chip to a conductor and the art, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of connecting a spaced IC chip to a conductor and the art will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1042028