Silicon polyimide precursor composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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524719, 524726, 524728, 524738, 524742, 524751, 524755, 524765, 524770, 528 34, 528 41, C08K 302

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active

050719084

ABSTRACT:
The present invention is directed to a silicon polyimide precursor composition which has a viscosity suitable for the formation of films by application or another mean and which is capable of forming hard and tough films having excellent heat resistance, low coefficient of thermal expansion and strong adhesive force by heating the films, the above-mentioned films being formed by the chemical bond between silicon and polyimide. Another feature of the present invention is directed to a method for preparing a crosslinked/cured material of the aforesaid silicon polyimide precursor composition.
That is, the present invention is connected with a soluble silicon polyimide precursor composition which comprises 0.5 to 40% by weight of a silicon polyimide precursor represented by the following formula (I) on another precursor obtained by imidizing the compound represented by the formula (I) and having a logarithmic viscosity number of 0.05 to 5 dl/g, 0.5 to 40% by weight of a condensate of a silicon compound represented by the following formula (II) and having a logarithmic viscosity number of 0.01 to 0.5 dl/g, and 50 to 99% by weight of a solvent: ##STR1## wherein G is ##STR2## or a hydrogen atom (except the case of n=0), R.sup.1 is independently a tetravalent carbon cyclic aromatic group, R.sup.2 is independently a carbon cyclic aromatic group, R.sup.3 is ##STR3## R.sup.4 is independently methyl or phenyl, R.sup.7 is independently alkyl having 1 to 6 carbon atoms or hydrogen, X is alkoxy, acetoxy or hydroxyl, n is n.gtoreq.0, k is 2.5.ltoreq.k.ltoreq.3, and m is 3.5<m.ltoreq.4.

REFERENCES:
patent: 4499252 (1985-02-01), Igarashi et al.
patent: 4609700 (1986-09-01), Kunimune et al.
patent: 4970283 (1990-11-01), Kunimune et al.

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