Method of manufacturing printed circuit board

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Other Related Categories

427 58, 4271263, C23C 2600

Type

Patent

Status

active

Patent number

052196070

Description

ABSTRACT:
A method of manufacturing a printed circuit comprising the following steps: in a connection portion of a printed circuit formed on an insulating substrate, another circuit portion such as a jumper circuit is applied with resin ink; and a connection circuit for the circuit terminal portion of said printed circuit is formed by applying electroconductive ink.

REFERENCES:
patent: 4327124 (1982-04-01), DesMarais
patent: 4454167 (1984-06-01), Bernot
patent: 4774634 (1988-09-01), Tate
patent: 4808434 (1989-02-01), Bennett
patent: 4845313 (1989-07-01), Endoh
patent: 4861640 (1989-08-01), Gurd
patent: 4917466 (1990-04-01), Nakamura
patent: 5100695 (1992-03-01), Kawakami

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing printed circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1041052

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.