Method of eliminating burrs on a lead frame with a thin metal co

Details Method of eliminating burrs on a lead frame with a thin metal co Method of eliminating burrs on a lead frame with a thin metal co

1989-02-24

1991-06-25

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437246, 437946, 437974, H01L 2156, H01L 23495

Patent

active

050266691

ABSTRACT:
A lead frame for a semiconductor device and a method for manufacturing the semiconductor device using the frame, the lead frame comprising a dice pad, inner leads, tie bar, outer leads and a thin metal layer of lead which is hard to melt and is easily transformed formed on the surface of that portion of the inner leads, outer leads and the tie bar which is not covered with the sealing resin. In injection molding of a resin material on the lead frame with a semiconductor chip therein, the gap between the lead frame and the mold is filled while the thin metal layer is transformed by the clamping pressure so that the burr may be prevented from being generated.

REFERENCES:
patent: 4441118 (1984-04-01), Fister et al.
patent: 4625228 (1986-11-01), Bischoff et al.
patent: 4750029 (1988-06-01), Futatsuka et al.
patent: 4768077 (1988-08-01), Scherer

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