Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1982-12-09
1984-11-06
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
29571, 148 15, 148187, 357 42, 357 91, H01L 2122, H01L 2978, H01L 21263
Patent
active
044803753
ABSTRACT:
A very simple process is provided, with reduced processing time, for making a CMOS structure using a single polysilicon, or other refractory metal, layer which includes forming a thin gate oxide on both N and P type semiconductor layers of a common substrate, forming a gate electrode simultaneously on the N type and on the P type layers and selectively implanting an N type impurity to form N+ source and drain regions in the P type layer. The semiconductor layers are then oxidized to form substantially thicker oxide, such a silicon dioxide, adjacent to the sides of the gate electrode over the P type layer than the thickness of the oxide adjacent to the sides of the gate electrode over the N type layer. Without using a mask, a P type impurity is implanted into the N type layer to form P+ source and drain regions.
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Cottrell Peter E.
Geipel, Jr. Henry J.
International Business Machines - Corporation
Limanek Stephen J.
Roy Upendra
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