Method of making an ion beam sputter-etched ventricular catheter

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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156643, 156644, 156668, A61B 2700

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044328532

ABSTRACT:
The centricular catheter 10 of the present invention comprises a multiplicity of inlet microtubules 12. Each microtubule has both a large opening 16 at its inlet end and a multiplicity of microscopic openings 18 along its lateral surfaces.
The microtubules are perforated by a new and novel ion beam sputter etch technique. The holes are etched in each microtubule by directing an ion beam 20 through an electro formed metal mesh mask 28 producing perforations having diameters ranging from about 14 microns to about 150 microns.
This combination of a multiplicity of fluoropolymer microtubes, the numerous small holes provided in the lateral surfaces of the tubes, and the hydra-like distribution of the tubes provide a new and novel catheter. This structure assures a reliable means for shunting cerebrospinal fluid from the cerebral ventricles to selected areas of the body.

REFERENCES:
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patent: 3437088 (1969-04-01), Bielinski
patent: 3595241 (1971-07-01), Sheridan
patent: 3633585 (1972-01-01), McDonald, Jr.
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P. D. Townsend et al., Ion Implantation, Sputtering and Their Applications, Academic Press, London, 1976, pp. 247-261.
J. L. Vossen et al., Thin Film Processes, Academic Press, New York, 1978, pp. 497-556.

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