Patent
1981-05-29
1984-01-03
Edlow, Martin H.
357 14, 357 22, 357 47, H01L 3100, H01L 2992, H01L 2980, H01L 2702
Patent
active
044245262
ABSTRACT:
A semiconductor substrate which contains a buried grid-like region of enhanced concentration of an impurity type opposite to that of the semiconductor substrate; and method for the fabrication thereof which includes providing beneath the upper surface of a semiconductor substrate at a first depth a continuous region of a first impurity type which is the same as that of the semiconductor substrate and wherein at preselected isolated discontinuous locations beneath said surface the first impurity type is at a second depth beneath said surface which is greater than said first depth, and then providing beneath said first depth and substantially coincident with said second depth, a second impurity type opposite to that of the first type and at a dosage level lower than the dosage level of the first impurity type so as to provide a grid-like region of enhanced concentration of impurity type opposite to that of the semiconductor substrate for collecting excess minority carriers in the semiconductor substrate.
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Hsieh et al., "A Field-tunneling Effect on the Collection of Alpha-Particle Generated Carriers in Silicon Devices" IEEE Electron Dev. Lett. vol. EDL-2, No. 4, Apr. 1980, pp. 103-105.
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McNutt, M. J. "Buried Channel Charge Transfer Device (CTD) Transient Radiation Hardening Using N-P-N Structures", IEEE Trans. on Nuclear Sci. vol. NS-27, No. 5, pp. 1338-1342, Oct. 1980.
Sugerman et al., "Semiconductor Device Structure with Low Soft Error Rate", IBM Tech. Disc. Bull., vol. 23, No. 2, pp. 616-617, Jul. 1980.
Yaney et al., "Alpha Particle Tracks in Silicon and their Effect on Dynamic MOS RAM Reliability" IEEE Trans. on Electron Dev., vol. ED-26, No. 1, pp. 10-16, Jan. 1979.
Dennard Robert H.
Wordeman Matthew R.
Badgett J. L.
Edlow Martin H.
International Business Machines - Corporation
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