Photo-electrode structure

Details Photo-electrode structure Photo-electrode structure

1975-05-06

1976-09-14

Segal, Robert

Electric lamp and discharge devices

Cathode ray tube

Image pickup tube

313390, 174 5061, 313482, H01J 2902, H01J 2908, H01J 3146, H01J 2990

Patent

active

039809170

ABSTRACT:
An electrode structure includes a pin that extends through a hole in a fragile substrate, such as a thin, glass plate, and makes contact with a conductive layer on one surface of the plate. The structure includes a first metallic adherent layer on that portion of the conductive layer and a second metal layer on the exposed surface of the first metal layer. The hole extends through the conductive layer and both of the metal layers. The first metal layer is adherent to the conductive layer and consists of iron, chromium, or nickel, for example, deposited on the conductive layer. The second metal layer is a fixative for the first layer and is wettable by soft solder. It consists of a noble metal from the group consisting of gold, silver, platinum and paladium. The pin has a head larger than the cross-section of the hole and a surface that is wettable by soft solder. A ring of soft solder encircles the pin and is solidified into joining relationship between the surface of the pin and the adjacent surrounding surface of the second metal layer to form a hermetic seal and an electrical connection between the pin and the second metal layer. The solder ring may be placed on the pin as a separate element, and its temperature may be raised to the molten state by heat treatment of the entire assembly, after which the solder resolidifies upon cooling.

REFERENCES:
patent: 3721752 (1973-03-01), Kakizaki et al.
patent: 3854069 (1974-12-01), Tagawa

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