1984-05-02
1985-12-31
Edlow, Martin H.
357 59, 357 65, 357 29, H01L 2348, H01L 2940
Patent
active
045624550
ABSTRACT:
A probing pad is formed on a semiconductor element to facilitate measurement by an electron beam tester, for operation analysis or other tests of the semiconductor element. The probing pad is electrically connected to an electro conductive medium from any desired potential measuring section through a contact hole.
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Miyoshi Motosuke
Okumura Katsuya
Edlow Martin H.
Jackson, Jr. Jerome
Tokyo Shibaura Denki Kabushiki Kaisha
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