Semiconductor element

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357 59, 357 65, 357 29, H01L 2348, H01L 2940

Patent

active

045624550

ABSTRACT:
A probing pad is formed on a semiconductor element to facilitate measurement by an electron beam tester, for operation analysis or other tests of the semiconductor element. The probing pad is electrically connected to an electro conductive medium from any desired potential measuring section through a contact hole.

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Electronics, Posa et al., "IEDM Unveils . . . Density", Dec. 6, 1979, vol. 52, No. 25, pp. 124-130.
Wolfgang et al., "Electron . . . Circuits", IEEE Journal of Solid State Circuits, vol. SC-14, No. 2, Apr. 1979.

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