Enhanced boron nitride composition and polymer based high therma

Details Enhanced boron nitride composition and polymer based high therma Enhanced boron nitride composition and polymer based high therma

1996-03-05

1997-10-28

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524322, 523445, C08J 510, C08K 338, C08L 6304

Patent

active

056818831

ABSTRACT:
The present invention relates to a boron nitride composition of particles of boron nitride and a nonionic surfactant for use as a filler with a distribution of agglomerates having an average particle size in the range of between 20-80 microns and to a molding compound having a high thermal conductivity of above at least 5 W/m.degree. K. The molding compound comprises a polymer base material, a filler and a nonionic surfactant with the filler comprising boron nitride in a concentration of at least 60% by weight of said composition and wherein the nonionic surfactant is selected from the class consisting of carboxylic acid amides and carboxylic acid esters.

REFERENCES:
patent: 5011872 (1991-04-01), Latham et al.
patent: 5498659 (1996-03-01), Esser
Improved Thermal Conductivity in Microelectronic Encapsulants Philip Procter and Jitka Sole--IEEE Transactions on Components, Hybrids & Manufacturing Technology, vol. 14 No. 4, Dec. 1991--pp. 708-713.
Thermal Conductivity of Molding Compounds for Plastic Packaging--P. Bujard & G.Kahnlein--Ciba Geigy SA, 1994 IEEE--pp. 159-163.
Thermal & Influence of Sample Preparation--P.Bujard--Ciba Geigy Ltd, Research Center 1988 IEEE--pp. 41-49.

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