Solder back contact

Details Solder back contact Solder back contact

1989-09-05

1991-06-04

Roy, Upendra

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

357 71, 428657, 428672, 428674, 437189, 437246, H01L 21283, C25D 360

Patent

active

050213008

ABSTRACT:
An integral solder back contact is provided over a semiconductor circuit. The solder contact includes a pair of layers which form an alloy at elevated temperatures. A semiconductor device having the integral solder back contact is mounted on the carrier and disposed at an elevated temperature which causes one of the layers to melt. The material of the other layer is dissolved in the melted layer until such melted layer has a sufficient amount of the material of the other layer dissolved therein to form an alloy which hardens. After the alloy hardens the circuit is firmly bonded to the carrier even while the carrier is exposed to the elevated temperature.

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patent: 4749628 (1988-06-01), Kadija et al.
patent: 4875617 (1989-10-01), Citowsky
patent: 4903110 (1990-02-01), Aono
patent: 4922322 (1990-05-01), Mathew

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