Integrated circuit package, and method of forming an integrated

Details Integrated circuit package, and method of forming an integrated Integrated circuit package, and method of forming an integrated

1985-05-20

1987-03-03

Edlow, Martin H.

357 81, 357 79, H01L 2302

Patent

active

046479597

ABSTRACT:
An integrated circuit package comprises an integrated circuit chip and a flexible sheet-form interconnect member that comprises dielectric material and conductor runs supported by the dielectric material in mutually-insulated relationship and having termination points arranged at the main face of the interconnect member in a pattern that corresponds with the pattern of contact pads on the interconnect face of the chip. The chip and the interconnect member are adhesively bonded together by means of a material that is interposed between the main face of the interconnect member and the interconnect face of the chip, but is not interposed between the contact pads and the termination points, and adheres to both the interconnect member and the chip.

REFERENCES:
patent: 3780352 (1973-12-01), Redwanz
patent: 4105861 (1978-08-01), Hascoe
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4251852 (1981-02-01), Ecker et al.
patent: 4446477 (1984-05-01), Currie et al.
patent: 4544989 (1985-10-01), Nakabu et al.

Affiliated with

Also associated with

Rating

Integrated circuit package, and method of forming an integrated does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package, and method of forming an integrated , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package, and method of forming an integrated will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1020110