Method of curing particle-coated substrates

Details Method of curing particle-coated substrates Method of curing particle-coated substrates

1980-01-09

1981-12-29

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 26, 427 27, 427206, B05D 306

Patent

active

043082963

ABSTRACT:
A method of curing the uncured adhesive on which elongated particles of material have been deposited in a relatively thick deposit or layer, (such as a flocked layer), the adhesive being on a substrate, which comprises subjecting the material to an electron beam directed toward the surface having the deposit, from apparatus for producing an electron beam of relatively low energy. The process is particularly adaptable to the curing of adhesives when used on heat-sensitive substrates, and/or where the particles may also be heat-sensitive, whose heat sensitivity would otherwise inherently limit the degree and speed of thermal curing that might be employed in order to cure the adhesive which holds the elongated particles to the substrate.

REFERENCES:
patent: 3903331 (1975-09-01), Klein
patent: 4100311 (1978-07-01), Nablo et al.

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