Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257692, 257783, H01L 2348, H01L 2946, H01L 2328, H01L 2302

Patent

active

051842084

ABSTRACT:
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.

REFERENCES:
patent: 4575748 (1986-03-01), Terui et al.
patent: 4630095 (1986-12-01), Otsuka et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4862245 (1989-08-01), Pashby et al.

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