Circuit module with improved heat transfer

Details Circuit module with improved heat transfer Circuit module with improved heat transfer

1998-04-08

2000-09-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361688, 361709, 361710, 361713, 361719, 361813, 257706, 257707, 257718, 257719, 174 163, 165 803, H05K 720

Patent

active

061186600

ABSTRACT:
An electronic assembly having one or more heat producing semiconductor components in the form of a chip or die has improved heat dissipation properties. The semiconductor components are formed into subassemblies comprising one or more of the semiconductor components bonded on opposite planar surfaces to metal lead frames. Each lead frame is bonded to a substrate which is electrically insulating and thermally conductive. The resulting assembly is submerged into a central channel of a heat sink. The channel is adapted to receive the assembly such that the channel walls compressingly engage the assembly. Heat is thereby dissipated from the semiconductor components from both planar surfaces of the component.

REFERENCES:
patent: 5184281 (1993-02-01), Samarov et al.

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