Flip chip type semiconductor device

Details Flip chip type semiconductor device Flip chip type semiconductor device

1989-02-22

1991-09-03

James, Andrew J.

357 68, 357 54, 357 72, H01L 2166, H01L 2934

Patent

active

050461613

ABSTRACT:
A flip chip type semiconductor device includes a substrate, a polyimide film and an inorganic passivation film. An opening having a rectangular configuration is formed in the inorganic passivation layer provided on an electrode pad. The polyimide film is formed within the opening and on the inorganic passivation layer only in the vicinity of the opening so that the polyimide film is not formed on a circuit element of the semiconductor device. A circular window is formed in the polyimide film within the opening. A bump structure formed in the window is electrically connected to the electrode pad.

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Noubel et al, "Metallurgy Including a Chromium Slice", IBM Technical Disclosure, vol. 11, No. 7, Dec./68, p. 769.
Marc Wittmer, "Barrier Layers: Principles and Applications in Microelectronics", J. Vac. Sci. Technology, Apr.-Jun. 84, pp. 273-280.

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