Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Patent
1990-06-04
1991-11-12
Nelms, David C.
Radiant energy
Photocells; circuits and apparatus
Photocell controlled circuit
2502272, 358482, H01J 4014
Patent
active
050650068
DESCRIPTION:
BRIEF SUMMARY
DESCRIPTION
1. Technical Field
This invention relates to an image sensor and a method of manufacturing the same.
2. Background Art
Conventional image sensors are typically of the type in which, as FIGS. 7(a) and 7(b) show, an image sensor chip 73 is fixedly mounted through the intermediary of a conductive adhesive 74 on an opaque substrate 71 formed with circuit conductor layers 72. An electrode 73A of the image sensor chip 73 is connected individually with the circuit conductor layers 72 by wire bonding using fine wire of a metal such as that of gold or aluminum. The assembly is sealingly covered with a transparent mold resin material 76. A plurality of photo sensors (not shown) are arranged on sides of individual electrodes 73A of the image sensor chip 73.
One drawback of such image sensor is that the electrodes 73A have to be connected individually with the circuit conductor layers 72 using fine metal wire 75, which involves very complicated wiring work. Another drawback is that the arrangement of the image sensor makes it difficult to adapt the electrodes 73A to be arranged at a reduced pitch.
Disclosure of the Invention
Therefore, it is an object of the invention to provide an image sensor which can be fabricated without involving complicated wiring work using fine metal wire and with improved efficiency, and which is of such construction as can be readily adapted to needs for reduced electrode pitch.
In order to accomplish this object, according to the invention there is provided an image sensor comprising a transparent substrate having circuit conductor layers formed thereon, and an image sensor chip having electrodes and photo sensors arranged on the underside thereof, the image sensor chip being in adhesion bond with the top surface of the substrate by means of a photo-setting type insulating resin.
According to the above arrangement, the electrodes of the image sensor chip are individually positioned directly on the circuit conductor layers formed on the transparent substrate, resulting in simplified wiring work and provides good adaptability to needs for reduced-pitch electrode arrangement.
BRIEF DESCRIPTION OF DRAWINGS
FIGS. 1(a) and 1(b) are, respectively, a side sectional view and a front sectional view of a first embodiment of the invention; FIGS. 2(a), 2(b) and 2(c) are, respectively, a side sectional view, a front sectional view, and a partially cutaway plan view of a second embodiment of the invention; FIGS. 3(a) and 3(b) are, respectively, a side sectional view and front sectional view of a third embodiment of the invention; FIG. 4 is a side sectional view of a fourth embodiment of the invention; FIGS. 5(a) and 5(b) are, respectively, a side sectional view and a decomposed side sectional view of a fifth embodiment of the invention; FIGS. 6(a), 6(b) and 6(c) are, respectively, a front sectional view, a partial plan view, and a side sectional view of a sixth embodiment of the invention; and FIGS. 7(a) and 7(b) are, respectively, a plan view and a front sectional view of a conventional arrangement.
BEST MODE FOR CARRYING OUT THE INVENTION
A first embodiment of the invention will now be described with reference to the accompanying drawings.
FIGS. 1(a) and 1(b) illustrate an image sensor of the first embodiment of the invention.
Numeral reference 11 designates a protective layer for protecting an image sensor chip 12. Numeral reference 13 designates a plurality of photo sensors provided on the underside of the image sensor chip 12. Numeral reference 14 designates a plurality of electrodes provided on the underside of the image sensor chip 12. Numeral reference 15 designates a protrusion-like conductor electrode provided on each of the electrodes 14 of the image sensor chip 12. Numeral reference 16 designates a transparent photo-setting type insulating resin for setting the image sensor chip 12 in place on the circuit conductor layers 17 formed on the upper side of the transparent substrate 18.
A method of manufacturing the image sensor of the above described construction will be exp
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Fujiwara Shinji
Murata Takahiko
Nakamura Tetsuro
Matsushita Electric Industrial Co., Inc.
Messinger Michael
Nelms David C.
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