Method of and device for placing chip-type electrical and/or ele

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29740, 228 62, H05K 330, B23P 1900

Patent

active

046446427

ABSTRACT:
A method of and a device for placing chip-type components on a substrate, in which a number of components are simultaneously picked up in presentation positions by means of a pick-up device which has a number of pick-up elements, after which the pick-up device is moved to a position over the substrate and each of the pick-up elements in succession is moved to a position over the desired position on the substrate by movement of the pick-up device and/or the substrate with respect to one another, after which the relevant component is deposited and released in the relevant position by the pick-up element.

REFERENCES:
patent: 3611561 (1971-10-01), Dosier
patent: 3859723 (1975-01-01), Hamer et al.
patent: 3958740 (1976-05-01), Dixon
patent: 4116376 (1978-09-01), Delorme et al.
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4290732 (1981-09-01), Taki et al.
patent: 4292116 (1981-09-01), Takahashi et al.
patent: 4345371 (1982-08-01), Ohsawa et al.
patent: 4346514 (1982-08-01), Makizawa et al.
patent: 4375126 (1983-03-01), Dull et al.
patent: 4381601 (1983-05-01), Tamai et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of and device for placing chip-type electrical and/or ele does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of and device for placing chip-type electrical and/or ele, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of and device for placing chip-type electrical and/or ele will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-101305

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.