Plastic packaged semiconductor device having bonding wires which

Details Plastic packaged semiconductor device having bonding wires which Plastic packaged semiconductor device having bonding wires which

1990-09-10

1991-09-03

Hille, Rolf

357 70, H01L 2348

Patent

active

050459198

ABSTRACT:
Bonding pads for deriving out electrodes of semiconductor elements formed on a pellet to the exterior are formed on the pellet. The pellet is mounted on a bed. Inner lead portions of a lead frame are arranged on the surrounding portion of the bed to extend radially away from the bed. A distance between those of the inner lead portions which are disposed in position corresponding to the corner portion of the bed is set larger than a distance between those of the inner lead portions which are disposed in the other position. The bonding pads are electrically connected to the inner lead portions by means of bonding wires. The pellet, bed, inner lead portions and bonding wires are sealed into a plastic package.

REFERENCES:
patent: 4258381 (1981-03-01), Inaba

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