Method of making a microcircuit substrate

Details Method of making a microcircuit substrate Method of making a microcircuit substrate

1984-01-23

1986-02-25

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29827, 29837, 29839, 29840, 29842, 29843, 29852, 357 69, 357 70, B32B 3120, H01L 2348

Patent

active

045727570

ABSTRACT:
Individual ceramic substrates for electronic microcircuits are formed in an array having rectangular perforations which define score lines along which the array is broken to yield the individual substrates. The surfaces of the rectangular perforations are metallized and leads are attached thereto by thermocompression bonding after the array is broken. The rectangular perforations result in semi-rectangular openings around the periphery of the individual substrates, which eliminate tensile forces on the substrate during lead bonding.

REFERENCES:
patent: 3780431 (1973-12-01), Feeney
patent: 3926746 (1975-12-01), Hargis
patent: 4224637 (1980-09-01), Hargis
patent: 4288841 (1981-09-01), Gogal
patent: 4331740 (1982-05-01), Burns

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